features ?plastic package has underwriters laboratory flammability classification 94v-0 ?dual rectifier construction, positive center-tap ?glass passivated chip junctions ?superfast recovery times for high efficiency ?low forward voltage, high current high current capability ?low thermal resistance, low power loss ?high temperature soldering guaranteed: 250?, 0.16 (4.06mm) from case for 10 seconds mechanical data case: jedec to-247ad molded plastic body over passivated chips terminals: plated leads solderable per mil-std-750, method 2026 polarity: as marked mounting position: any mounting torque: 10 in. - lbs. max. weight: 0.22 oz., 6.3 g pin 1 pin 3 case 0.245 (6.2) 0.225 (5.7) 0.645 (16.4) 0.625 (15.9) 0.323 (8.2) 0.313 (7.9) 0.142 (3.6) 0.138 (3.5) 0.170 (4.3) 0.086 (2.18) 0.076 (1.93) 0.160 (4.1) 0.140 (3.5) 0.225 (5.7) 0.205 (5.2) 0.127 (3.22) 0.117 (2.97) 0.048 (1.22) 0.044 (1.12) 0.795 (20.2) 0.775 (19.6) 0.840 (21.3) 0.820 (20.8) 1 2 3 0.078 ref (1.98) 0.203 (5.16) 0.193 (4.90) 10 typ. both sides 30 10 1 ref. 0.118 (3.0) 0.108 (2.7) 0.030 (0.76) 0.020 (0.51) both sides pin 2 to-247ad (to-3p) fep30ap thru fep30jp vishay semiconductors formerly general semiconductor document number 88597 www.vishay.com 21-mar-02 1 dual ultrafast plastic rectifier reverse voltage 50 to 600 v forward current 30 a dimensions in inches and (millimeters) maximum ratings and thermal characteristics ratings at 25 c ambient temperature unless otherwise noted. fep fep fep fep fep fep fep fep parameter symbol 30ap 30bp 30cp 30dp 30fp 30gp 30hp 30jp unit maximum repetitive peak reverse voltage v rrm 50 100 150 200 300 400 500 600 v maximum rms voltage v rms 35 70 105 140 210 280 350 420 v maximum dc blocking voltage v dc 50 100 150 200 300 400 500 600 v maximum average forward rectified current i f(av) 30 a at t c = 100 c peak forward surge current 8.3 ms single half sine-wave superimposed i fsm 300 a on rated load (jedec method) at t c = 100 c typical thermal reisistance (1) r jc 1.0 c/w operating storage and temperature range t j ,t stg -55 to +150 c/w electrical characteristics fep fep fep fep fep fep fep fep parameter symbol 30ap 30bp 30cp 30dp 30fp 30gp 30hp 30jp unit maximum instantaneous forward voltage v f 0.95 1.3 1.5 v per leg at 15.0 a maximum dc reverse current at t c = 25 c i r 10 a rated dc blocking voltage t c = 100 c 500 maximum reverse recovery time per leg at t rr 35 50 ns i f = 0.5a, i r = 1.0a, i rr = 0.25a typical junction capacitance per leg at 4.0v, 1mh z c j 175 145 pf notes: (1) thermal resistance from junction to case per leg mounted on heatsink
fep30ap thru fep30jp vishay semiconductors formerly general semiconductor www.vishay.com document number 88597 2 21-mar-02 ratings and characteristic curves (t a = 25 c unless otherwise noted) 0 50 100 150 0 6.0 12 24 30 36 1 10 100 0 50 100 150 200 250 300 0.2 0.6 0.4 0.8 1.0 1.2 1.4 1.6 0.1 1 10 40 0.1 1 10 100 10 100 1,000 0 20 40 60 80 100 0.1 0.01 1 10 100 fig. 2 ?maximum non-repetitive peak forward surge current per leg peak forward surge current (a) number of cycles at 60 h z fig. 1 ?forward current derating curve average forward current (a) case temperature ( c) instantaneous forward voltage (v) fig. 3 ?typical instantaneous forward characteristics per leg fig. 4 ?typical reverse characteristics per leg instantaneous reverse leakage current ( a) percent of rated peak reverse voltage (%) instantaneous forward current (a) reverse voltage (v) junction capacitance (pf) fig. 5 ?typical junction capacitance resistive or inductive load t c = 100 c 8.3ms single half sine-wave (jedec method) 50 - 200v 300 - 400v 500 - 600v pulse width = 300 s 1% duty cycle t j = 25 c t j = 125 c t j = 100 c t j = 25 c 50 - 200v 300 - 600v t j = 25 c t j = 25 c f = 1.0 mhz vsig = 50mvp-p 50 - 400v 500 - 600v
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